1727 search results - page 120 / 346 » An Integrated Approach to Manufacturing Process Design and C... |
127
click to vote
ICCAD
2009
IEEE
15 years 2 months ago
2009
IEEE
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
125
click to vote
DATE
2007
IEEE
15 years 11 months ago
2007
IEEE
This paper tackles the problem of dynamic power management (DPM) in nanoscale CMOS design technologies that are typically affected by increasing levels of process, voltage, and te...
158
click to vote
DFG
2004
Springer
15 years 8 months ago
2004
Springer
Programmable Logic Controllers (PLC) are widespread in the manufacturing and processing industries to realize sequential procedures and to avoid safety-critical states. For the spe...
142
click to vote
GECCO
2004
Springer
15 years 10 months ago
2004
Springer
Abstract. The current trend in Embedded Systems (ES) design is moving towards the integration of increasingly complex applications on a single chip. An Embedded System has to satis...
152
click to vote
PETRA
2010
ACM
15 years 3 months ago
2010
ACM
Automatic surveillance of a scene in a broad sense comprises one of the core modules of pervasive applications. Typically, multiple cameras are installed in an area to identify ev...