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ICCAD
2003
IEEE
109views Hardware» more  ICCAD 2003»
14 years 4 months ago
Large-Scale Circuit Placement: Gap and Promise
Placement is one of the most important steps in the RTLto-GDSII synthesis process, as it directly defines the interconnects, which have become the bottleneck in circuit and syste...
Jason Cong, Tim Kong, Joseph R. Shinnerl, Min Xie,...
TCAD
2002
135views more  TCAD 2002»
13 years 7 months ago
Area fill synthesis for uniform layout density
Chemical-mechanical polishing (CMP) and other manufacturing steps in very deep submicron VLSI have varying effects on device and interconnect features, depending on local character...
Yu Chen, Andrew B. Kahng, Gabriel Robins, Alexande...
ISJGP
2010
13 years 4 months ago
On the Hardware Implementation Cost of Crypto-Processors Architectures
A variety of modern technologies such as networks, Internet, and electronic services demand private and secure communications for a great number of everyday transactions. Security ...
Nicolas Sklavos
ICCAD
1997
IEEE
90views Hardware» more  ICCAD 1997»
13 years 11 months ago
A hierarchical decomposition methodology for multistage clock circuits
† This paper describes a novel methodology to automate the design of the interconnect distribution for multistage clock circuits. We introduce two key ideas. First, a hierarchica...
Gary Ellis, Lawrence T. Pileggi, Rob A. Rutenbar