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TCAD
2008
114views more  TCAD 2008»
13 years 7 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
HIPEAC
2010
Springer
14 years 4 months ago
Low-Overhead, High-Speed Multi-core Barrier Synchronization
Whereas efficient barrier implementations were once a concern only in high-performance computing, recent trends in core integration make the topic relevant even for general-purpos...
John Sartori, Rakesh Kumar
PUC
2008
141views more  PUC 2008»
13 years 6 months ago
MobGeoSen: facilitating personal geosensor data collection and visualization using mobile phones
Mobile sensing and mapping applications are becoming more prevalent because sensing hardware is becoming more portable and more affordable. However, most of the hardware uses small...
Eiman Kanjo, Steve Benford, Mark Paxton, Alan Cham...
CLUSTER
2005
IEEE
14 years 28 days ago
Memory Management Support for Multi-Programmed Remote Direct Memory Access (RDMA) Systems
Current operating systems offer basic support for network interface controllers (NICs) supporting remote direct memory access (RDMA). Such support typically consists of a device d...
Kostas Magoutis
ISCAS
2006
IEEE
206views Hardware» more  ISCAS 2006»
14 years 1 months ago
JPEG2000 image coding system theory and applications
JPEG2000, the new standard for still image coding, Quantization, user defined wavelets, arbitrary wavelet provides a new framework and an integrated toolbox to better decomposition...
Athanassios N. Skodras, Touradj Ebrahimi