65 search results - page 11 / 13 » An on Chip ADC Test Structure |
MICRO
2006
IEEE
14 years 1 months ago
2006
IEEE
Design variability due to die-to-die and within-die process variations has the potential to significantly reduce the maximum operating frequency and the effective yield of high-p...
ICCAD
2009
IEEE
13 years 5 months ago
2009
IEEE
In this paper, we propose a new technique, referred to as virtual probe (VP), to efficiently measure, characterize and monitor both inter-die and spatially-correlated intra-die va...
ICES
2005
Springer
14 years 1 months ago
2005
Springer
This paper describes circuit evolutionary experiments at extreme low temperatures, including the test of all system components at this extreme environment (EE). In addition to hard...
INFOCOM
2007
IEEE
14 years 1 months ago
2007
IEEE
Abstract—Deep packet inspection (DPI) is often used in network intrusion detection and prevention systems (NIDPS), where incoming packet payloads are compared against known attac...
IPPS
2007
IEEE
14 years 1 months ago
2007
IEEE
This paper explores generating efficient, portable HighSpeed Producer Consumer (HSPC) code on current shared memory architectures: Chip Multi-Processors (CMP), Simultaneous Multi...