65 search results - page 4 / 13 » An on Chip ADC Test Structure |
ISQED
2003
IEEE
14 years 22 days ago
2003
IEEE
An intermediate solution between conventional printed circuit board technology and wafer level packaging, WLP, is to fabricate interconnection circuits and flip chip assembly stru...
MR
2008
13 years 7 months ago
2008
The effects of bonding temperatures on the composite properties and reliability performances of anisotropic conductive films (ACFs) for flip chip on organic substrates assemblies ...
DSD
2006
IEEE
14 years 1 months ago
2006
IEEE
Testing of high density SoCs operating at high clock speeds is an important but difficult problem. Many faults, like delay faults, in such sub-micron chips may only appear when th...
ADC
2008
Springer
14 years 1 months ago
2008
Springer
Several XML query languages have been proposed that use XPath expressions to locate data. But XPath expressions might miss some data because of irregularities in the data and sche...
ICCAD
2008
IEEE
14 years 4 months ago
2008
IEEE
Abstract— Process variations make at-speed testing significantly more difficult. They cause subtle delay changes that are distributed rather than the localized nature of a trad...