We describe a new extraction tool, EMX (Electro-Magnetic eXtractor), for the analysis of RF, analog and high-speed digital circuits. EMX is a fast full-wave field solver. It incor...
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
This paper examines the opportunity of using compression for accelerating the (re)configuration of FPGA devices, focusing on the choice of compression algorithms, and their hardwa...
Abstract--A novel input and output biasing circuit to extend the input common mode (CM) voltage range and the output swing to rail-to-rail in a low voltage op-amp in standard CMOS ...
S. V. Gopalaiah, A. P. Shivaprasad, Sukanta K. Pan...
Teaching the practical aspects of device and chip design in New Zealand presents many problems, including high manufacturing costs, long lead times, and the lack of local industry...
Richard J. Blaikie, Maan M. Alkaisi, Steven M. Dur...