The increasing prominence of portable systems and the need to limit power consumption and hence, heat dissipation in very high density VLSI chips have led to rapid and innovative ...
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinm...
In this paper we argue that the explicit capture of crosscutting concerns in code should be the natural consequence of good and clean modularity in analysis and design, based on f...
Computer understanding of visual languages in pen-based environments requires a combination of lexical analysis in which the basic tokens are recognized from hand-drawn gestures an...
Adrian C. Bickerstaffe, Aidan Lane, Bernd Meyer, K...
Worldwide competition originated the development of Integrated E-Supply Chains (IESC) that are distributed manufacturing systems integrating international logistics and informatio...
Mariagrazia Dotoli, Maria Pia Fanti, Agostino Marc...