3 search results - page 1 / 1 » Analytical thermal placement for VLSI lifetime improvement a... |
ICCD
2007
IEEE
14 years 4 months ago
2007
IEEE
DSM and nanometer VLSI designs are subject to an increasingly significant thermal effect on VLSI circuit lifetime and performance variation, which can be effectively subdued by V...
GLVLSI
2008
IEEE
13 years 8 months ago
2008
IEEE
The main contribution of this work is an analytical model for finding the upper bound on the temperature difference among various locations on the die. The proposed model can be u...
ISCAS
1999
IEEE
13 years 11 months ago
1999
IEEE
- Micromachined power sensors with operation up to 50 GHz were recently achieved in CMOS technology [1]. To improve their sensitivity and signal-to-noise ratio, while maintaining m...