218 search results - page 19 / 44 » Analyzing Packaging Trade-Offs During System Design |
DATE
1999
IEEE
14 years 3 months ago
1999
IEEE
This paper describes a simulation technique for RealTime Hw/Sw systems based on an object executable model. It allows designers to seamlessly estimate and verify their solutions f...
VVS
2000
IEEE
14 years 3 months ago
2000
IEEE
This paper describes architecture and implementation of the ULTRAVIS system, a pure software solution for versatile and fast volume rendering. It provides perspective raycasting, ...
IOLTS
2008
IEEE
14 years 5 months ago
2008
IEEE
Present and future semiconductor technologies are characterized by increasing parameters variations as well as an increasing susceptibility to external disturbances. Transient err...
ICRA
2007
IEEE
14 years 5 months ago
2007
IEEE
— Human Machine Collaborative Systems (HMCS) have been developed to enhance sensation and suppress extraneous motions or forces during surgical tasks requiring precise motion. Ho...
HICSS
2002
IEEE
14 years 3 months ago
2002
IEEE
We are developing a module-oriented, multiphysics, mixed-fidelity system simulation environment that will enable engineers to rapidly analyze the performance of a system and to o...