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» Analyzing Packaging Trade-Offs During System Design
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DAC
2006
ACM
14 years 4 months ago
Use of C/C++ models for architecture exploration and verification of DSPs
Architectural decisions for DSP modules are often analyzed using high level C models. Such high-level explorations allow early examination of the algorithms and the architectural ...
David Brier, Raj S. Mitra
BIOINFORMATICS
2010
170views more  BIOINFORMATICS 2010»
13 years 11 months ago
Joint estimation of DNA copy number from multiple platforms
DNA copy number variants (CNV) are gains and losses of segments of chromosomes, and comprise an important class of genetic variation. Recently, various microarray hybridization ba...
Nancy R. Zhang, Yasin Senbabaoglu, Jun Z. Li
ISLPED
2007
ACM
169views Hardware» more  ISLPED 2007»
14 years 14 days ago
Throughput of multi-core processors under thermal constraints
We analyze the effect of thermal constraints on the performance and power of multi-core processors. We propose system-level power and thermal models, and derive expressions for (a...
Ravishankar Rao, Sarma B. K. Vrudhula, Chaitali Ch...
ICCAD
2001
IEEE
127views Hardware» more  ICCAD 2001»
14 years 7 months ago
What is the Limit of Energy Saving by Dynamic Voltage Scaling?
Dynamic voltage scaling (DVS) is a technique that varies the supply voltage and clock frequency based on the computation load to provide desired performance with the minimal amoun...
Gang Qu
CANDC
2009
ACM
13 years 8 months ago
Designing to support reasoned imagination through embodied metaphor
Supporting users' reasoned imagination in sense making during interaction with tangible and embedded computation involves supporting the application of their existing mental ...
Alissa Nicole Antle, Greg Corness, Saskia Bakker, ...