218 search results - page 3 / 44 » Analyzing Packaging Trade-Offs During System Design |
DAC
2006
ACM
14 years 8 months ago
2006
ACM
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
ASPDAC
2006
ACM
13 years 11 months ago
2006
ACM
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
DAC
1998
ACM
13 years 11 months ago
1998
ACM
We present a technique for synthesizing power- as well as area-optimized circuits from hierarchical data flow graphs under throughput constraints. We allow for the use of complex...
COLCOM
2008
IEEE
14 years 1 months ago
2008
IEEE
Environmental monitoring is one of the most important sensor network application domains. The success of those applications is determined by the quality of the collected data. Thu...
HPDC
2012
IEEE
11 years 9 months ago
2012
IEEE
Hadoop has become a critical component in today’s cloud environment. Ensuring good performance for Hadoop is paramount for the wide-range of applications built on top of it. In ...