We have developed a system architecture, measuring and modeling techniques, and algorithms for on-line power and energy optimization and thermal management. The starting point for...
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
Because of the aggressive scaling of integrated circuits and the given limits of atomic scales, circuit designers have to become more and more aware of the arising reliability and...
In the way they cope with variability, present-day methodologies are onerous, pessimistic and risky, all at the same time! Dealing with variability is an increasingly important as...
We demonstrate how to use placement to ameliorate the predicted repeater explosion problem caused by poor interconnect scaling. We achieve repeater count reduction by dynamically ...
Brent Goplen, Prashant Saxena, Sachin S. Sapatneka...