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ISLPED
2010
ACM
153views Hardware» more  ISLPED 2010»
13 years 8 months ago
Leakage minimization using self sensing and thermal management
We have developed a system architecture, measuring and modeling techniques, and algorithms for on-line power and energy optimization and thermal management. The starting point for...
Alireza Vahdatpour, Miodrag Potkonjak
ICCAD
2010
IEEE
146views Hardware» more  ICCAD 2010»
13 years 6 months ago
Through-silicon-via management during 3D physical design: When to add and how many?
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
SBCCI
2009
ACM
131views VLSI» more  SBCCI 2009»
14 years 25 days ago
Twin logic gates: improved logic reliability by redundancy concerning gate oxide breakdown
Because of the aggressive scaling of integrated circuits and the given limits of atomic scales, circuit designers have to become more and more aware of the arising reliability and...
Hagen Sämrow, Claas Cornelius, Frank Sill, An...
DAC
2003
ACM
14 years 9 months ago
Death, taxes and failing chips
In the way they cope with variability, present-day methodologies are onerous, pessimistic and risky, all at the same time! Dealing with variability is an increasingly important as...
Chandu Visweswariah
DAC
2005
ACM
14 years 9 months ago
Net weighting to reduce repeater counts during placement
We demonstrate how to use placement to ameliorate the predicted repeater explosion problem caused by poor interconnect scaling. We achieve repeater count reduction by dynamically ...
Brent Goplen, Prashant Saxena, Sachin S. Sapatneka...