1398 search results - page 168 / 280 » Application-Specific Integrated Circuits |
DATE
2010
IEEE
14 years 1 months ago
2010
IEEE
: Scaling down in very deep submicron (VDSM) technologies increases the delay, power consumption of on-chip interconnects, while the reliability and yield decrease. In high perform...
DAC
1996
ACM
14 years 4 days ago
1996
ACM
This paper provides a case study that shows how a demanding application stresses the capabilities of today's CAD tools, especially in the integration of products from multipl...
FTEDA
2008
13 years 8 months ago
2008
With greater integration, the power dissipation in integrated circuits has begun to outpace the ability of today's heat sinks to limit the on-chip temperature. As a result, t...
ET
2010
13 years 6 months ago
2010
In this work we investigate the problem of simultaneous privacy and integrity protection in cryptographic circuits. We consider a white-box scenario with a powerful, yet limited at...
FPGA
2009
ACM
14 years 2 months ago
2009
ACM
Aggressive scaling increases the number of devices we can integrate per square millimeter but makes it increasingly difficult to guarantee that each device fabricated has the inte...