1398 search results - page 169 / 280 » Application-Specific Integrated Circuits |
DATE
2009
IEEE
14 years 2 months ago
2009
IEEE
Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on C...
ISQED
2005
IEEE
14 years 1 months ago
2005
IEEE
Due to the rapid development of manufacturing process technology and tight marketing schedule, the chip design and manufacturing always work toward an integrated solution to achie...
ITC
2003
IEEE
14 years 1 months ago
2003
IEEE
As technology evolves into the deep sub-micron era, signal integrity problems are growing into a major challenge. An important source of signal integrity problems is the crosstalk...
ASPDAC
2006
ACM
13 years 11 months ago
2006
ACM
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
MOBISYS
2004
ACM
14 years 7 months ago
2004
ACM
Many approaches exist today that address the issues that arise when a mobile node changes its point(s) of attachment to the Internet. Mobile IP takes care of host mobility at the ...