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DAC
2011
ACM
12 years 7 months ago
Non-uniform micro-channel design for stacked 3D-ICs
Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with m...
Bing Shi, Ankur Srivastava, Peng Wang
FPT
2005
IEEE
134views Hardware» more  FPT 2005»
14 years 1 months ago
Post-Silicon Debug Using Programmable Logic Cores
Producing a functionally correct integrated circuit is becoming increasingly difficult. No matter how careful a designer is, there will always be integrated circuits that are fabr...
Bradley R. Quinton, Steven J. E. Wilton
DAC
2005
ACM
13 years 9 months ago
Variation-tolerant circuits: circuit solutions and techniques
Die-to-die and within-die variations impact the frequency and power of fabricated dies, affecting functionality, performance, and revenue. Variation-tolerant circuits and post-sil...
James Tschanz, Keith A. Bowman, Vivek De
VLSID
2004
IEEE
75views VLSI» more  VLSID 2004»
14 years 8 months ago
Quantitative Model for Thermal Behaviour of an Analog Integrated Circuit
Gagandeep S. Sandha, Pawan K. Singh, C. Pradeep Ku...
SIGOPSE
1994
ACM
13 years 11 months ago
New Directions for Integrated Circuit Cards Operating Systems
Integrated circuit cards or smart cards are now well-known. Applications such as electronic purses (cash units stored in cards), subscriber identification cards used in cellular te...
Pierre Paradinas, Jean-Jacques Vandewalle