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ASPDAC
2006
ACM
14 years 3 months ago
2006
ACM
Power consumption has gained much saliency in circuit design recently. One design problem is modelled as ”Under a timing constraint, to minimize power as much as possible”. Pr...
ICCD
2004
IEEE
14 years 6 months ago
2004
IEEE
Three dimensional vertically integrated systems allow active devices to be placed on multiple device layers. In recent years, a number of research efforts have addressed physical ...
DBSEC
2010
13 years 11 months ago
2010
Abstract. In considering a problem in access control for scalable multimedia formats, we have developed new methods for constructing a key assignment scheme. Our first contribution...
ASPDAC
2004
ACM
14 years 3 months ago
2004
ACM
—The routing environment for the new emerging mixed-signal System-on-Package (SOP) technology is more advanced than that of the conventional PCB or MCM technology – pins are lo...
SLIP
2009
ACM
14 years 4 months ago
2009
ACM
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...