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CODES
2007
IEEE
14 years 1 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
ICDE
2007
IEEE
211views Database» more  ICDE 2007»
14 years 1 months ago
Document Representation and Dimension Reduction for Text Clustering
Increasingly large text datasets and the high dimensionality associated with natural language create a great challenge in text mining. In this research, a systematic study is cond...
M. Mahdi Shafiei, Singer Wang, Roger Zhang, Evange...
IDEAS
2007
IEEE
135views Database» more  IDEAS 2007»
14 years 1 months ago
Bitmap Index Design Choices and Their Performance Implications
Historically, bitmap indexing has provided an important database capability to accelerate queries. However, only a few database systems have implemented these indexes because of t...
Elizabeth J. O'Neil, Patrick E. O'Neil, Kesheng Wu
MICRO
2007
IEEE
168views Hardware» more  MICRO 2007»
14 years 1 months ago
Global Multi-Threaded Instruction Scheduling
Recently, the microprocessor industry has moved toward chip multiprocessor (CMP) designs as a means of utilizing the increasing transistor counts in the face of physical and micro...
Guilherme Ottoni, David I. August
GECCO
2007
Springer
200views Optimization» more  GECCO 2007»
14 years 1 months ago
Adaptive variance scaling in continuous multi-objective estimation-of-distribution algorithms
Recent research into single–objective continuous Estimation– of–Distribution Algorithms (EDAs) has shown that when maximum–likelihood estimations are used for parametric d...
Peter A. N. Bosman, Dirk Thierens