218 search results - page 41 / 44 » Benefits and challenges for platform-based design |
ICDE
2010
IEEE
14 years 7 months ago
2010
IEEE
Scientific workflows are increasingly used for rapid integration of existing algorithms to form larger and more comgrams. Such workflows promise to provide more abstract, yet execu...
DATE
2009
IEEE
14 years 2 months ago
2009
IEEE
—As semiconductor manufacturing enters advanced nanometer design paradigm, aging and device wear-out related degradation is becoming a major concern. Negative Bias Temperature In...
HICSS
2007
IEEE
14 years 1 months ago
2007
IEEE
Increased market dynamics, shorter product lifecycles and a higher customer involvement in product design have caused great changes to competitive conditions and many companies ar...
MICRO
2006
IEEE
14 years 1 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
ASPLOS
2004
ACM
14 years 22 days ago
2004
ACM
Increased integration in the form of multiple processor cores on a single die, relatively constant die sizes, shrinking power envelopes, and emerging applications create a new cha...