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ICCD
2008
IEEE
202views Hardware» more  ICCD 2008»
14 years 4 months ago
CrashTest: A fast high-fidelity FPGA-based resiliency analysis framework
— Extreme scaling practices in silicon technology are quickly leading to integrated circuit components with limited reliability, where phenomena such as early-transistor failures...
Andrea Pellegrini, Kypros Constantinides, Dan Zhan...
ICCD
2003
IEEE
123views Hardware» more  ICCD 2003»
14 years 4 months ago
Simplifying SoC design with the Customizable Control Processor Platform
With the circuit density available in today’s ASIC design systems, increased integration is possible creating more complexity in the design of a System on a Chip (SoC). IBM’s ...
C. Ross Ogilvie, Richard Ray, Robert Devins, Mark ...
HOTI
2008
IEEE
14 years 1 months ago
A High-Speed Optical Multi-Drop Bus for Computer Interconnections
Buses have historically provided a flexible communications structure in computer systems. However, signal integrity constraints of high-speed electronics have made multi-drop elec...
Michael R. T. Tan, Paul Rosenberg, Jong Souk Yeo, ...
DATE
2006
IEEE
152views Hardware» more  DATE 2006»
14 years 1 months ago
Adaptive chip-package thermal analysis for synthesis and design
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
Yonghong Yang, Zhenyu (Peter) Gu, Changyun Zhu, Li...
CASES
2006
ACM
14 years 1 months ago
Modeling heterogeneous SoCs with SystemC: a digital/MEMS case study
Designers of SoCs with non-digital components, such as analog or MEMS devices, can currently use high-level system design languages, such as SystemC, to model only the digital par...
Ankush Varma, Muhammad Yaqub Afridi, Akin Akturk, ...