70 search results - page 3 / 14 » Bringing 3D to Teleradiology |
ICRA
2009
IEEE
14 years 2 months ago
2009
IEEE
— In our recent work [1], [2], we proposed Point Feature Histograms (PFH) as robust multi-dimensional features which describe the local geometry around a point p for 3D point clo...
ICPP
2008
IEEE
14 years 2 months ago
2008
IEEE
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and ...
HAPTICS
2006
IEEE
14 years 1 months ago
2006
IEEE
The purpose of the Virtual Haptic Back (VHB) project is to develop a realistic haptic/graphical model of the human back that can be used for palpation (diagnosis though touch) in ...
ICRA
2005
IEEE
14 years 1 months ago
2005
IEEE
Abstract— In this paper, we propose a three-dimensional (3D) measurement method of objects in aquatic environments whose refractive indices or boundary shape of the refraction ar...
ICCAD
2010
IEEE
13 years 5 months ago
2010
IEEE
3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...