43 search results - page 8 / 9 » Capacitive Leadframe Testing |
CORR
2008
Springer
13 years 7 months ago
2008
Springer
This paper presents an analysis and system-level design of a capacitive harvester of vibration energy composed from a mechanical resonator, capacitive transducer and a conditioning...
ISQED
2007
IEEE
14 years 1 months ago
2007
IEEE
The inductance effects become significant for sub-100nm process designs due to increasing interconnect lengths, lower interconnect resistance values and fast signal transition tim...
IPSN
2007
Springer
14 years 1 months ago
2007
Springer
In this paper, we present a wireless sensor platform designed for processing multipoint human motion with low latency and high resolution. One application considered here is inter...
ISCAS
2006
IEEE
2006
IEEE
Microelectromechanical systems in 3D SOI-CMOS: sensing electronics embedded in mechanical structures
14 years 1 months ago
— We discuss the design of CMOS MEMS in a 3D SOI-CMOS technology. We present layout architectures, preliminary mechanics modeling using finite element analysis and release proce...
ICCAD
1995
IEEE
13 years 10 months ago
1995
IEEE
Pad assignment with signal integrity optimization is very important for high-speed VLSI design. In this paper, an efficient method is proposed to effectively minimize both simulta...