Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
Throughput, power consumption, signal integrity, pin count and routing complexity are all increasingly important interconnect issues that the system designer must deal with. Recen...
— The enhanced packing densities facilitated by 3D integrated circuit technology also has an unwanted side-effect, in the form of increasing the amount of current per unit footpr...
Novel reconfigurable computing architectures exploit the inherent parallelism available in many signalprocessing problems. These architectures often consist of networks of compute...
This paper describes the challenges presented by singlechip parallel media processors (PMPs). These machines integrate multiple parallel function units, instruction execution, and...