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» Challenges in Physical Chip Design
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ASPDAC
2006
ACM
148views Hardware» more  ASPDAC 2006»
14 years 16 days ago
TAPHS: thermal-aware unified physical-level and high-level synthesis
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
Zhenyu (Peter) Gu, Yonghong Yang, Jia Wang, Robert...
SLIP
2004
ACM
14 years 2 months ago
Optical solutions for system-level interconnect
Throughput, power consumption, signal integrity, pin count and routing complexity are all increasingly important interconnect issues that the system designer must deal with. Recen...
Ian O'Connor
ASPDAC
2009
ACM
104views Hardware» more  ASPDAC 2009»
14 years 3 months ago
Addressing thermal and power delivery bottlenecks in 3D circuits
— The enhanced packing densities facilitated by 3D integrated circuit technology also has an unwanted side-effect, in the form of increasing the amount of current per unit footpr...
Sachin S. Sapatnekar
DATE
2003
IEEE
123views Hardware» more  DATE 2003»
14 years 2 months ago
Parallel Processing Architectures for Reconfigurable Systems
Novel reconfigurable computing architectures exploit the inherent parallelism available in many signalprocessing problems. These architectures often consist of networks of compute...
Kees A. Vissers
ICPP
1999
IEEE
14 years 1 months ago
Parallel Media Processors for the Billion-Transistor Era
This paper describes the challenges presented by singlechip parallel media processors (PMPs). These machines integrate multiple parallel function units, instruction execution, and...
Jason Fritts, Zhao Wu, Wayne Wolf