As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
With the ever-increasing pervasiveness of the Internet and its stringent performance requirements, network system designers have begun utilizing specialized chips to increase the ...
The Pentium computer chip’s division algorithm relies on a table from which five entries were inadvertently omitted, with the result that 1738 single precision dividenddivisor ...
This paper considers the problem of performing decentralised coordination of low-power embedded devices (as is required within many environmental sensing and surveillance applicat...
Alessandro Farinelli, Alex Rogers, Adrian Petcu, N...
Dynamic binary translators (DBT) have recently attracted much attention for embedded systems. The effective implementation of DBT in these systems is challenging due to tight cons...