— Energy efficiency has become one of the most important issues to be addressed in today’s System-on-a-Chip (SoC) designs. One way to lower the power consumption is to reduce ...
In temperature-aware design, the presence or absence of a heatsink fundamentally changes the thermal behavior with important design implications. In recent years, chip-level infra...
Wei Huang, Kevin Skadron, Sudhanva Gurumurthi, Rob...
— The area-I/O flip-chip package provides a high chip-density solution to the demand of more I/O’s in VLSI designs; it can achieve smaller package size, shorter wirelength, an...
We expect that many-core microprocessors will push performance per chip from the 10 gigaflop to the 10 teraflop range in the coming decade. To support this increased performance...
Dana Vantrease, Robert Schreiber, Matteo Monchiero...
Dynamic software bug detection tools are commonly used because they leverage run-time information. However, they suffer from a fundamental limitation, the Path Coverage Problem: t...