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GLVLSI
2005
IEEE
199views VLSI» more  GLVLSI 2005»
14 years 1 months ago
Interconnect delay minimization through interlayer via placement in 3-D ICs
The dependence of the propagation delay of the interlayer 3-D interconnects on the vertical through via location and length is investigated. For a variable vertical through via lo...
Vasilis F. Pavlidis, Eby G. Friedman
ATS
2003
IEEE
98views Hardware» more  ATS 2003»
14 years 24 days ago
Automatic Design Validation Framework for HDL Descriptions via RTL ATPG
We present a framework for high-level design validation using an efficient register-transfer level (RTL) automatic test pattern generator (ATPG). The RTL ATPG generates the test ...
Liang Zhang, Michael S. Hsiao, Indradeep Ghosh
ISCAS
2002
IEEE
88views Hardware» more  ISCAS 2002»
14 years 13 days ago
Energy dissipation modeling of lossy transmission lines driven by CMOS inverters
- In this paper, new formulations for the energy dissipation of lossy transmission lines driven by CMOS inverters are provided. These formulations are obtained using an approximate...
Payam Heydari
CORR
2007
Springer
74views Education» more  CORR 2007»
13 years 7 months ago
Secure Two-party Protocols for Point Inclusion Problem
It is well known that, in theory, the general secure multiparty computation problem is solvable using circuit evaluation protocols. However, the communication complexity of the re...
Tony Thomas
PKC
2012
Springer
255views Cryptology» more  PKC 2012»
11 years 10 months ago
Better Bootstrapping in Fully Homomorphic Encryption
Gentry’s bootstrapping technique is currently the only known method of obtaining a “pure” fully homomorphic encryption (FHE) schemes, and it may offers performance advantage...
Craig Gentry, Shai Halevi, Nigel P. Smart