Ever shrinking device sizes and innovative micro-architectural and circuit design techniques have made it possible to have multi-million transistor systems running at multi-gigahe...
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
This paper presents an energy management policy for reconfigurable clusters running a multi-tier application, exploiting DVS together with multiple sleep states. We develop a the...
With aggressive superscalar processors delivering diminishing returns, alternate designs that make good use of the increasing chip densities are actively being explored. One such ...
The shrinking processor feature size, lower threshold voltage and increasing clock frequency make modern processors highly vulnerable to transient faults. Architectural Vulnerabil...