I/O placement has always been a concern in modern IC design. Due to flip-chip technology, I/O can be placed throughout the whole chip without long wires from the periphery of the...
Hung-Ming Chen, I-Min Liu, Martin D. F. Wong, Muzh...
This work presents a new and computationally efficient performance optimization technique for distributed RLC interconnects based on a rigorous delay computation scheme. The new o...
—Underwater Sensor Networks are typically distributed in nature and the nodes communicate using acoustic waves over a wireless medium. Such networks are characterized by long and...
Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC ...
This article reports on a neural prosthesis stimulation system for long-term use in animal electrical stimulation experiments. The presented system consists of an implantable stim...
Jingai Zhou, Se Joon Woo, Se Ik Park, Seung Woo Le...