82 search results - page 5 / 17 » Clockless IC design using handshake technology |
DATE
2009
IEEE
14 years 3 months ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
DELTA
2002
IEEE
14 years 1 months ago
2002
IEEE
Teaching the practical aspects of device and chip design in New Zealand presents many problems, including high manufacturing costs, long lead times, and the lack of local industry...
DAC
2007
ACM
14 years 14 days ago
2007
ACM
This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a repl...
ICCAD
2004
IEEE
14 years 5 months ago
2004
IEEE
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...
IC
2001
13 years 10 months ago
2001
In this paper, we describe the design and implementation of an XML-Based Digital Video Library (XDVL) System. The system includes automatic processes from video creation through v...