— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
Young-Joon Lee, Yoon Jo Kim, Gang Huang, Muhannad ...
Teaching the practical aspects of device and chip design in New Zealand presents many problems, including high manufacturing costs, long lead times, and the lack of local industry...
Richard J. Blaikie, Maan M. Alkaisi, Steven M. Dur...
This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a repl...
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...
In this paper, we describe the design and implementation of an XML-Based Digital Video Library (XDVL) System. The system includes automatic processes from video creation through v...