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ASPDAC
2007
ACM
164views Hardware» more  ASPDAC 2007»
14 years 1 months ago
Thermal-Aware 3D IC Placement Via Transformation
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
Jason Cong, Guojie Luo, Jie Wei, Yan Zhang
JETC
2008
127views more  JETC 2008»
13 years 8 months ago
Automated module assignment in stacked-Vdd designs for high-efficiency power delivery
With aggressive reductions in feature sizes and the integration of multiple functionalities on the same die, bottlenecks due to I/O pin limitations have become a severe issue in to...
Yong Zhan, Sachin S. Sapatnekar
ECOWS
2007
Springer
13 years 11 months ago
SSL-over-SOAP: Towards a Token-based Key Establishment Framework for Web Services
Key establishment is essential for many applications of cryptography. Its purpose is to negotiate keys for other cryptographic schemes, usually for encryption and authentication. I...
Sebastian Gajek, Lijun Liao, Bodo Möller, J&o...
TVLSI
2008
116views more  TVLSI 2008»
13 years 9 months ago
Adaptive Cooling of Integrated Circuits Using Digital Microfluidics
Thermal management is critical for integrated circuit (IC) design. With each new IC technology generation, feature sizes decrease, while operating speeds and package densities incr...
Philip Y. Paik, Vamsee K. Pamula, Krishnendu Chakr...
ICCAD
2007
IEEE
128views Hardware» more  ICCAD 2007»
14 years 6 months ago
Module assignment for pin-limited designs under the stacked-Vdd paradigm
Abstract— This paper addresses the module assignment problem in pinlimited designs under the stacked-Vdd circuit paradigm. A partition-based algorithm is presented for efficient...
Yong Zhan, Tianpei Zhang, Sachin S. Sapatnekar