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123
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ICCAD
2008
IEEE
16 years 8 days ago
2008
IEEE
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
115
Voted
ICCAD
2001
IEEE
16 years 8 days ago
2001
IEEE
Efficient high level design tools that can map behavioral descriptions to FPGA architectures are one of the key requirements to fully leverage FPGA for high throughput computatio...
126
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ICCAD
2001
IEEE
16 years 8 days ago
2001
IEEE
Dynamic voltage scaling (DVS) is a technique that varies the supply voltage and clock frequency based on the computation load to provide desired performance with the minimal amoun...
121
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SOSP
2001
ACM
16 years 8 days ago
2001
ACM
As raw system and network performance continues to improve at exponential rates, the utility of many services is increasingly limited by availability rather than performance. A ke...
126
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WWW
2010
ACM
15 years 10 months ago
2010
ACM
Dynamic resource provisioning aims at maintaining the endto-end response time of a web application within a predefined SLA. Although the topic has been well studied for monolithi...