— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
Efficient high level design tools that can map behavioral descriptions to FPGA architectures are one of the key requirements to fully leverage FPGA for high throughput computatio...
Malay Haldar, Anshuman Nayak, Alok N. Choudhary, P...
Dynamic voltage scaling (DVS) is a technique that varies the supply voltage and clock frequency based on the computation load to provide desired performance with the minimal amoun...
As raw system and network performance continues to improve at exponential rates, the utility of many services is increasingly limited by availability rather than performance. A ke...
Dynamic resource provisioning aims at maintaining the endto-end response time of a web application within a predefined SLA. Although the topic has been well studied for monolithi...