As technology scales, interconnects dominate the performance and power behavior of deep submicron designs. Three-dimensional integrated circuits (3D ICs) have been proposed as a w...
Presently, Architecture Description Languages (ADLs) are widely used to raise the abstraction level of the design space exploration of Application Specific Instruction-set Proces...
Ernst Martin Witte, Anupam Chattopadhyay, Oliver S...
I/O placement has always been a concern in modern IC design. Due to flip-chip technology, I/O can be placed throughout the whole chip without long wires from the periphery of the...
Hung-Ming Chen, I-Min Liu, Martin D. F. Wong, Muzh...
We present a method for incorporating crosstalk reduction criteria into global routing under an innovative power supply architecture, while considering the constraints imposed by ...
Microprocessor performance has been improved by increasing the capacity of on-chip caches. However, the performance gain comes at the price of increased static energy consumption ...
Heather Hanson, M. S. Hrishikesh, Vikas Agarwal, S...