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ISPD
2004
ACM
189views Hardware» more  ISPD 2004»
14 years 4 days ago
Almost optimum placement legalization by minimum cost flow and dynamic programming
VLSI placement tools usually work in two steps: First, the cells that have to be placed are roughly spread out over the chip area ignoring disjointness (global placement). Then, i...
Ulrich Brenner, Anna Pauli, Jens Vygen
DAC
2003
ACM
13 years 12 months ago
Force directed mongrel with physical net constraints
This paper describes a new force directed global placement algorithm that exploits and extends techniques from two leading placers, Force-directed [12] [26] and Mongrel [22]. It c...
Sung-Woo Hur, Tung Cao, Karthik Rajagopal, Yegna P...
SLIP
2003
ACM
13 years 12 months ago
Perimeter-degree: a priori metric for directly measuring and homogenizing interconnection complexity in multilevel placement
In this paper, we describe an accurate metric (perimeter-degree) for measuring interconnection complexity and effective use of it for controlling congestion in a multilevel framew...
Navaratnasothie Selvakkumaran, Phiroze N. Parakh, ...
CF
2007
ACM
13 years 10 months ago
An analysis of the effects of miss clustering on the cost of a cache miss
In this paper we describe a new technique, called pipeline spectroscopy, and use it to measure the cost of each cache miss. The cost of a miss is displayed (graphed) as a histogra...
Thomas R. Puzak, Allan Hartstein, Philip G. Emma, ...
DAC
2010
ACM
13 years 10 months ago
TSV stress aware timing analysis with applications to 3D-IC layout optimization
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Jae-Seok Yang, Krit Athikulwongse, Young-Joon Lee,...