510 search results - page 59 / 102 » Computing Stack Maps with Interfaces |
DAC
2010
ACM
13 years 11 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
NOCS
2010
IEEE
13 years 6 months ago
2010
IEEE
—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
OZCHI
2006
ACM
14 years 1 months ago
2006
ACM
This paper proposes the design rationale of a wearable display that is able to convey the behavioral typology of its wearers by merging insights from wearable computing, aesthetic...
IPPS
2008
IEEE
14 years 2 months ago
2008
IEEE
MPI Alltoall is one of the most communication intense collective operation used in many parallel applications. Recently, the supercomputing arena has witnessed phenomenal growth o...
ACSC
2005
IEEE
14 years 1 months ago
2005
IEEE
Curriculum based on internetworking devices is primarily based on the Command Line Interface (CLI) and case studies. However a single CLI command may produce output that is not on...