6 search results - page 1 / 2 » Congestion-driven codesign of power and signal networks |
DATE
2009
IEEE
14 years 5 months ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
DAC
2002
ACM
14 years 12 months ago
2002
ACM
DATE
2004
IEEE
14 years 2 months ago
2004
IEEE
Conventional physical design flow separates the design of power network and signal network. Such a separated approach results in slow design convergence for wire-limited deep sub-...
ICCD
2004
IEEE
14 years 7 months ago
2004
IEEE
I/O placement has always been a concern in modern IC design. Due to flip-chip technology, I/O can be placed throughout the whole chip without long wires from the periphery of the...
CODES
2008
IEEE
14 years 5 months ago
2008
IEEE
Body-area sensor network or BAN-based health monitoring is increasingly becoming a popular alternative to traditional wired bio-monitoring techniques. However, most biomonitoring ...