Through-silicon via (TSV) fabrication causes tensile stress around TSVs which results in significant carrier mobility variation in the devices in their neighborhood. Keep-out zone ...
Abstract-- We present a computational framework for automatic synthesis of a feedback control strategy for a piecewise affine (PWA) system from a specification given as a Linear Te...
Jana Tumova, Boyan Yordanov, Calin Belta, Ivana Ce...
A 3D pendulum consists of a rigid body, supported at a fixed pivot, with three rotational degrees of freedom. The pendulum is acted on by a gravitational force. Symmetry assumptio...
Nalin A. Chaturvedi, Taeyoung Lee, Melvin Leok, N....
Abstract. Sensing mechanisms that estimate the occupancy of wireless spectrum are crucial to the success of approaches based on Dynamic Spectrum Access. In this paper, we present k...
Daniel Willkomm, Sridhar Machiraju, Jean Bolot, Ad...
We present the first reduced-dimensional technique to simulate the dynamics of thin sheets of viscous incompressible liquid in three dimensions. Beginning from a discrete Lagrang...
Christopher Batty, Andres Uribe, Basile Audoly, Ei...