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ICCAD
2010
IEEE
216views Hardware» more  ICCAD 2010»
13 years 5 months ago
Stress-driven 3D-IC placement with TSV keep-out zone and regularity study
Through-silicon via (TSV) fabrication causes tensile stress around TSVs which results in significant carrier mobility variation in the devices in their neighborhood. Keep-out zone ...
Krit Athikulwongse, Ashutosh Chakraborty, Jae-Seok...
CDC
2010
IEEE
129views Control Systems» more  CDC 2010»
13 years 2 months ago
A symbolic approach to controlling piecewise affine systems
Abstract-- We present a computational framework for automatic synthesis of a feedback control strategy for a piecewise affine (PWA) system from a specification given as a Linear Te...
Jana Tumova, Boyan Yordanov, Calin Belta, Ivana Ce...
JNS
2011
77views more  JNS 2011»
13 years 2 months ago
Nonlinear Dynamics of the 3D Pendulum
A 3D pendulum consists of a rigid body, supported at a fixed pivot, with three rotational degrees of freedom. The pendulum is acted on by a gravitational force. Symmetry assumptio...
Nalin A. Chaturvedi, Taeyoung Lee, Melvin Leok, N....
NETWORKING
2011
12 years 10 months ago
The Problem of Sensing Unused Cellular Spectrum
Abstract. Sensing mechanisms that estimate the occupancy of wireless spectrum are crucial to the success of approaches based on Dynamic Spectrum Access. In this paper, we present k...
Daniel Willkomm, Sridhar Machiraju, Jean Bolot, Ad...
TOG
2012
209views Communications» more  TOG 2012»
11 years 9 months ago
Discrete viscous sheets
We present the first reduced-dimensional technique to simulate the dynamics of thin sheets of viscous incompressible liquid in three dimensions. Beginning from a discrete Lagrang...
Christopher Batty, Andres Uribe, Basile Audoly, Ei...