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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
14 years 4 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
HPDC
2008
IEEE
14 years 2 months ago
Improving peer connectivity in wide-area overlays of virtual workstations
Self-configuring virtual networks rely on structured P2P routing to provide seamless connectivity among nodes through overlay routing of virtual IP packets, support decentralized...
Arijit Ganguly, P. Oscar Boykin, David Wolinsky, R...
ICC
2009
IEEE
101views Communications» more  ICC 2009»
14 years 2 months ago
Interference Subtraction with Supplementary Cooperation in Wireless Cooperative Networks
Abstract—In wireless networks, the broadcast nature of wireless transmission enables cooperation by sharing the same transmissions with nearby receivers and thus can help improve...
Zhengguo Sheng, Zhiguo Ding, Kin K. Leung
CCGRID
2008
IEEE
14 years 2 months ago
Pastel: Bridging the Gap between Structured and Large-State Overlays
Peer-to-peer overlays envision a single overlay substrate that can be used (possibly simultaneously) by many applications, but current overlays either target fast, few-hop lookups...
Nuno Cruces, Rodrigo Rodrigues, Paulo Ferreira
INFOCOM
2008
IEEE
14 years 2 months ago
Cross-Monotonic Multicast
—In the routing and cost sharing of multicast towards a group of potential receivers, cross-monotonicity is a property that states a user’s payment can only be smaller when ser...
Zongpeng Li