Power dissipation is unevenly distributed in modern microprocessors leading to localized hot spots with significantly greater die temperature than surrounding cooler regions. Exc...
— In three-dimensional (3D) chips, the amount of supply current per package pin is significantly more than in two-dimensional (2D) designs. Therefore, the power supply noise pro...
Pingqiang Zhou, Karthikk Sridharan, Sachin S. Sapa...
Existing stable matching algorithms reveal the preferences of all participants, as well as the history of matches made and broken in the course of computing a stable match. This in...
Since on-chip routers in Network-on-Chips play a key role in on-chip communication between cores, they should be always preparing for packet injections even if a part of cores are ...
As IC technologies scale to finer feature sizes, it becomes increasingly difficult to control the relative process variations. The increasing fluctuations in manufacturing process...