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SDM
2009
SIAM
204views Data Mining» more  SDM 2009»
14 years 7 months ago
Application of Bayesian Partition Models in Warranty Data Analysis.
Automotive companies are forced to continuously extend and improve their product line-up. However, increasing diversity, higher design complexity, and shorter development cycles c...
Axel Blumenstock, Christoph Schlieder, Markus M&uu...
EUROGRAPHICS
2010
Eurographics
14 years 7 months ago
Uncertain 2D Vector Field Topology
We introduce an approach to visualize stationary 2D vector fields with global uncertainty obtained by considering the transport of local uncertainty in the flow. For this, we ex...
Mathias Otto, Tobias Germer, Hans-Christian Hege, ...
ICCD
2006
IEEE
117views Hardware» more  ICCD 2006»
14 years 7 months ago
System-Level Energy Modeling for Heterogeneous Reconfigurable Chip Multiprocessors
—Field-Programmable Gate Array (FPGA) technology is characterized by continuous improvements that provide new opportunities in system design. Multiprocessors-ona-Programmable-Chi...
Xiaofang Wang, Sotirios G. Ziavras
ICCAD
2008
IEEE
161views Hardware» more  ICCAD 2008»
14 years 7 months ago
A low-overhead fault tolerance scheme for TSV-based 3D network on chip links
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
ICCAD
2006
IEEE
165views Hardware» more  ICCAD 2006»
14 years 7 months ago
A fast block structure preserving model order reduction for inverse inductance circuits
Most existing RCL−1 circuit reductions stamp inverse inductance L−1 elements by a second-order nodal analysis (NA). The NA formulation uses nodal voltage variables and describ...
Hao Yu, Yiyu Shi, Lei He, David Smart