150 search results - page 1 / 30 » Design and CAD for 3D integrated circuits |
DAC
2008
ACM
14 years 12 months ago
2008
ACM
GLVLSI
2009
IEEE
2009
IEEE
On the complexity of graph cuboidal dual problems for 3-D floorplanning of integrated circuit design
14 years 5 months ago
This paper discusses the impact of migrating from 2-D to 3-D on floorplanning and placement. By looking at a basic formulation of graph cuboidal dual problem, we show that the 3-...
ISVLSI
2003
IEEE
14 years 4 months ago
2003
IEEE
Three-dimensional integration technologies have been proposed in order to mitigate design challenges posed by deep-submicron interconnect. By providing multiple layers of active d...
ASPDAC
2010
ACM
13 years 9 months ago
2010
ACM
SLIP
2009
ACM
14 years 5 months ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...