38 search results - page 1 / 8 » Design and Management of 3D Chip Multiprocessors Using Netwo... |
ISCA
2006
IEEE
14 years 3 months ago
2006
IEEE
Long interconnects are becoming an increasingly important problem from both power and performance perspectives. This motivates designers to adopt on-chip network-based communicati...
MJ
2011
13 years 4 months ago
2011
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
TCAD
2008
13 years 9 months ago
2008
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
BIRTHDAY
2012
Springer
12 years 5 months ago
2012
Springer
3-D integration presents many new opportunities for architects and embedded systems designers. However, 3-D integration has not yet been explored by the cryptographic hardware com...
SAC
2006
ACM
14 years 3 months ago
2006
ACM
The reduction of image reconstruction time is needed to spread the use of PET for research and routine clinical practice. In this purpose, this article presents a hardware/softwar...