1799 search results - page 114 / 360 » Design considerations for MRAM |
116
Voted
ICCD
2007
IEEE
16 years 1 months ago
2007
IEEE
One of the biggest challenges in 3D stacked IC design is heat dissipation. Incorporating thermal vias is a promising method for reducing the temperatures of 3D ICs. The bonding st...
135
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COMPSAC
2009
IEEE
15 years 11 months ago
2009
IEEE
The evolving concepts of mobile computing, context-awareness, and ambient intelligence are increasingly influencing user's experience of services. Therefore, the goal of this...
151
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WASA
2009
Springer
15 years 11 months ago
2009
Springer
Abstract. In this paper, we show through a simple secure symmetric key based protocol design and its implementation the feasibility of secure data collection in a vehicular sensor ...
138
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DATE
2008
IEEE
15 years 11 months ago
2008
IEEE
Continuous and discrete components can be integrated in diverse systems including defense, medical, electronic, communication, and automotive applications. Given the heterogeneity...
119
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DATE
2008
IEEE
15 years 11 months ago
2008
IEEE
We report the successful application of a resistive bridging fault (RBF) simulator to industrial benchmark circuits. Despite the slowdown due to the consideration of the sophistic...