88 search results - page 11 / 18 » Design for manufacturability in submicron domain |
ITC
2003
IEEE
14 years 24 days ago
2003
IEEE
As technology evolves into the deep sub-micron era, signal integrity problems are growing into a major challenge. An important source of signal integrity problems is the crosstalk...
ICCAD
2000
IEEE
13 years 12 months ago
2000
IEEE
Spurred by technology leading to the availability of millions of gates per chip, system-level integration is evolving as a new paradigm, allowing entire systems to be built on a s...
IJITN
2010
13 years 4 months ago
2010
With the proliferation of inexpensive cameras and the availability of high-speed wired and wireless networks, systems of distributed cameras are becoming an enabling technology fo...
DATE
2006
IEEE
13 years 11 months ago
2006
IEEE
We present a methodology, an environment and supporting tools to map an application on a wireless sensor network (WSN). While the method is quite general, we use extensively an exa...
IAAI
1993
13 years 8 months ago
1993
This paper describes a large rule-based application called Engineering Standards Distribution System (ESDS). ESDS was built and deployed by Boeing and helps design engineers speci...