4394 search results - page 5 / 879 » Designing agent chips |
ICCD
2006
IEEE
14 years 7 months ago
2006
IEEE
— As the geometries of the transistors reach the physical limits of operation, one of the main design challenges of Systems-on-Chips (SoCs) will be to provide dynamic (run-time) ...
ICCD
2004
IEEE
14 years 7 months ago
2004
IEEE
I/O placement has always been a concern in modern IC design. Due to flip-chip technology, I/O can be placed throughout the whole chip without long wires from the periphery of the...
ASPDAC
2007
ACM
14 years 2 months ago
2007
ACM
Deep submicron effects drive the complication in designing chips, as well as in package designs and communications between package and board. As a result, the iterative interface d...
TC
2008
13 years 10 months ago
2008
The design and performance of next-generation chip multiprocessors (CMPs) will be bound by the limited amount of power that can be dissipated on a single die. We present photonic n...
DATE
2009
IEEE
14 years 5 months ago
2009
IEEE
Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on C...