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ICCAD
2009
IEEE
135views Hardware» more  ICCAD 2009»
13 years 5 months ago
Enhanced reliability-aware power management through shared recovery technique
While Dynamic Voltage Scaling (DVS) remains as a popular energy management technique for real-time embedded applications, recent research has identified significant and negative i...
Baoxian Zhao, Hakan Aydin, Dakai Zhu
ASPDAC
2006
ACM
148views Hardware» more  ASPDAC 2006»
13 years 11 months ago
TAPHS: thermal-aware unified physical-level and high-level synthesis
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
Zhenyu (Peter) Gu, Yonghong Yang, Jia Wang, Robert...
TVLSI
2008
207views more  TVLSI 2008»
13 years 7 months ago
Effective Radii of On-Chip Decoupling Capacitors
Decoupling capacitors are widely used to reduce power supply noise. On-chip decoupling capacitors have traditionally been allocated into the white space available on a die or place...
Mikhail Popovich, Michael Sotman, Avinoam Kolodny,...
CSE
2009
IEEE
14 years 2 months ago
Prospector: Multiscale Energy Measurement of Networked Embedded Systems with Wideband Power Signals
Abstract—Today’s wirelessly networked embedded systems underlie a vast array of electronic devices, performing computation, communication, and input/output. A major design goal...
Kenji R. Yamamoto, Paul G. Flikkema
CODES
2007
IEEE
14 years 1 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick