While Dynamic Voltage Scaling (DVS) remains as a popular energy management technique for real-time embedded applications, recent research has identified significant and negative i...
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
Decoupling capacitors are widely used to reduce power supply noise. On-chip decoupling capacitors have traditionally been allocated into the white space available on a die or place...
Mikhail Popovich, Michael Sotman, Avinoam Kolodny,...
Abstract—Today’s wirelessly networked embedded systems underlie a vast array of electronic devices, performing computation, communication, and input/output. A major design goal...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...