Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
This paper presents Capriccio, a scalable thread package for use with high-concurrency servers. While recent work has advocated event-based systems, we believe that threadbased sy...
J. Robert von Behren, Jeremy Condit, Feng Zhou, Ge...
As high-end computing systems continue to grow in scale, the performance that applications can achieve on such large scale systems depends heavily on their ability to avoid explic...
Gopalakrishnan Santhanaraman, Pavan Balaji, K. Gop...
—Performance degradation of memory-intensive programs caused by the LRU policy’s inability to handle weaklocality data accesses in the last level cache is increasingly serious ...
—Sensor networks represent a new frontier in technology that holds the promise of unprecedented levels of autonomy in the execution of complex dynamic missions by harnessing the ...