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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
14 years 4 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
SOSP
2003
ACM
14 years 4 months ago
Capriccio: scalable threads for internet services
This paper presents Capriccio, a scalable thread package for use with high-concurrency servers. While recent work has advocated event-based systems, we believe that threadbased sy...
J. Robert von Behren, Jeremy Condit, Feng Zhou, Ge...
CCGRID
2009
IEEE
14 years 2 months ago
Natively Supporting True One-Sided Communication in
As high-end computing systems continue to grow in scale, the performance that applications can achieve on such large scale systems depends heavily on their ability to avoid explic...
Gopalakrishnan Santhanaraman, Pavan Balaji, K. Gop...
IEEEPACT
2009
IEEE
14 years 2 months ago
Soft-OLP: Improving Hardware Cache Performance through Software-Controlled Object-Level Partitioning
—Performance degradation of memory-intensive programs caused by the LRU policy’s inability to handle weaklocality data accesses in the last level cache is increasingly serious ...
Qingda Lu, Jiang Lin, Xiaoning Ding, Zhao Zhang, X...
COMSWARE
2007
IEEE
14 years 2 months ago
Situation-Aware Software Engineering for Sensor Networks
—Sensor networks represent a new frontier in technology that holds the promise of unprecedented levels of autonomy in the execution of complex dynamic missions by harnessing the ...
Vir V. Phoha, Shashi Phoha
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