Abstract— Interconnect has become a primary bottleneck in integrated circuit design. As CMOS technology is scaled, it will become increasingly difficult for conventional copper ...
As the family of Alpha microprocessors continues to scale into more advanced technologies with very high frequency edge rates and multiple layers of interconnect, the issue of cha...
Tens and eventually hundreds of processing cores are projected to be integrated onto future microprocessors, making the global interconnect a key component to achieving scalable c...
Mark J. Cianchetti, Joseph C. Kerekes, David H. Al...
A summary of electrical and optical approaches to clock distribution within high-performance microprocessors is presented. System-level properties of intrachip electrical clock dis...
A. V. Mule, Elias N. Glytsis, Thomas K. Gaylord, J...
We expect that many-core microprocessors will push performance per chip from the 10 gigaflop to the 10 teraflop range in the coming decade. To support this increased performance...
Dana Vantrease, Robert Schreiber, Matteo Monchiero...