15474 search results - page 2965 / 3095 » Emergent process design |
IROS
2006
IEEE
14 years 3 months ago
2006
IEEE
— There is much to gain from providing walking machines with passive dynamics, e.g. by including compliant elements in the structure. These elements can offer interesting propert...
IROS
2006
IEEE
14 years 3 months ago
2006
IEEE
— Our long-term objective is to develop robots that engage in natural language-mediated cooperative tasks with humans. To support this goal, we are developing an amodal represent...
ISQED
2006
IEEE
14 years 3 months ago
2006
IEEE
It is well known that fill insertion adversely affects total and coupling capacitance of interconnects. While grounded fill can be extracted by full-chip extractors, floating ...
MICRO
2006
IEEE
14 years 3 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
ACIVS
2006
Springer
14 years 3 months ago
2006
Springer
Abstract. We present an algorithm for interpolating the visible portions of a point cloud that are sampled from opaque objects in the environment. Our algorithm projects point clou...