3 search results - page 1 / 1 » Energy-efficient variable-flow liquid cooling in 3D stacked ... |
ICCAD
2010
IEEE
13 years 8 months ago
2010
IEEE
3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
DATE
2010
IEEE
14 years 4 months ago
2010
IEEE
DAC
2011
ACM
12 years 10 months ago
2011
ACM
Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with m...