Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...
: With technology scaling, elevated temperatures caused by increased power density create a critical bottleneck modulating the circuit operation. With the advent of FinFET technolo...
Abstract-- The operational characteristics of integrated circuits based on nanoscale semiconductor technology are expected to be increasingly affected by variations in the manufact...
Negative bias temperature instability (NBTI) in MOSFETs is one of the major reliability challenges in nano-scale technology. This paper presents an efficient technique to characte...
Kunhyuk Kang, Kee-Jong Kim, Ahmad E. Islam, Muhamm...
We propose a new architecture for a content protection system that conceals confidential data and algorithms in an FPGA as electrical circuits. This architecture is designed for a...