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DAC
2006
ACM
14 years 8 months ago
Exploring compromises among timing, power and temperature in three-dimensional integrated circuits
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...
ASPDAC
2006
ACM
159views Hardware» more  ASPDAC 2006»
14 years 1 months ago
Compact thermal models for estimation of temperature-dependent power/performance in FinFET technology
: With technology scaling, elevated temperatures caused by increased power density create a critical bottleneck modulating the circuit operation. With the advent of FinFET technolo...
Aditya Bansal, Mesut Meterelliyoz, Siddharth Singh...
TVLSI
2010
13 years 2 months ago
Variation-Aware System-Level Power Analysis
Abstract-- The operational characteristics of integrated circuits based on nanoscale semiconductor technology are expected to be increasingly affected by variations in the manufact...
Saumya Chandra, Kanishka Lahiri, Anand Raghunathan...
DAC
2007
ACM
14 years 8 months ago
Characterization and Estimation of Circuit Reliability Degradation under NBTI using On-Line IDDQ Measurement
Negative bias temperature instability (NBTI) in MOSFETs is one of the major reliability challenges in nano-scale technology. This paper presents an efficient technique to characte...
Kunhyuk Kang, Kee-Jong Kim, Ahmad E. Islam, Muhamm...
RTCSA
2005
IEEE
14 years 29 days ago
FPGA-Based Content Protection System for Embedded Consumer Electronics
We propose a new architecture for a content protection system that conceals confidential data and algorithms in an FPGA as electrical circuits. This architecture is designed for a...
Hiroyuki Yokoyama, Kenji Toda