Temperature is becoming a first rate design criterion in ASICs due to its negative impact on leakage power, reliability, performance, and packaging cost. Incorporating awareness o...
Rajarshi Mukherjee, Seda Ogrenci Memik, Gokhan Mem...
—Power consumption has emerged as the premier and most constraining aspect in modern microprocessor and application-specific designs. Gate sizing has been shown to be one of the...
Foad Dabiri, Ani Nahapetian, Miodrag Potkonjak, Ma...
For a nanoCMOS of sub-65nm technology, where the gate oxide (SiO2) thickness is very low, the gate leakage is one of the major components of power dissipation. In this paper, we pr...
Power consumption has emerged as the premier and most constraining aspect in modern microprocessor and application-specific designs. Gate sizing has been shown to be one of the mos...
Foad Dabiri, Ani Nahapetian, Tammara Massey, Miodr...
The power consumption of Dynamically Reconfigurable Processing Array (DRPA) is quantitatively analyzed by using a real chip layout and applications taking into account the reconfi...